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淡泊以明志,宁静以致远 Dr. Tang Lihua Research Fellow BLK N1, #B1A-01A, Nanyang Ave 50, Singapore 639798 |
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| EDUCATION: | |||
| 2008.01 ~ 2012.07 | Ph.D. | Nanyang Technological University | Structures & Mechanics |
| 2005.09 ~ 2007.12 | M.S. | Shanghai Jiao Tong University | Solid Mechanics |
| 2001.09 ~ 2005.07 | B.S. | Shanghai Jiao Tong University | Engineering Mechanics |
| CURRENT RESEARCH INTERESTS : | |||
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| PUBLICATIONS: | |||
Book Chapters: Journal papers: Conference papers: |
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| MAIN HONORS: | |||
| 2006.12 | "Yang You" Scholarship, SJTU | ||
| 2005.09 | "Yu Tong" Mechanics Competition, First Place in SJTU | ||
| 2005.06 | Outstanding Graduate, SJTU | ||
| 2004.12 | "Zhou Peiyuan" Mechanics Competition, Third Place in Shanghai | ||
| 2004.09 | Pan-Deng Scholarship in Mechanics, Institute of Mechanics, Chinese Academy of Sciences | ||
| 2003.12 | Excellent Academic Scholarship (Class B), SJTU | ||
| 2003.01 | Excellent Academic Scholarship (Class B), SJTU | ||
| WORKING EXPERIENCE: | |||
| 2006.12 ~ 2007.07 | Company | Singapore Technologies Electronics | |
| Title | Dynamics Simulation Engineer | ||
| Description | |||
| PROJECT EXPERIENCE: | |||
| 2007.07 ~ 2007.12 | Project | Thermal Fatigue Analysis of Chip Solder Joints — Daikin Industries, Ltd. |
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| Description | Thermo-structural coupled finite element modeling of a chip in an air conditioner by ABAQUS. |
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| 2006.11 | Project | Deflection and Strength Analysis of Folding Box — Depo (Kunshan) Company |
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| Description | Responsible for finite element modeling of a folding box and strength evaluation of joints with computed deformation and stress distribution by ABAQUS. |
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| 2006.02 ~ 2006.05 | Project | Elaso-plastic Analysis of Container Surface Crack Extension Mode under Residual Stress |
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| Description | Responsible for 3-D finite element modeling of the elliptical crack of a pressure container used in a nuclear power plants, and elaso-plastic parametric analysis with python in ABAQUS. |
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| SKILLS: | |||
| FEM: | ABAQUS & ANSYS for piezoelectric, viscoelastic, plastic and thermal analysis | ||
| Coding: | Fortran, C++, Java, Python, APDL | ||
| Mathematics: | Matlab, Mathematica | ||
| EDA: | Multisim | ||
| Physics Engine: | ODE, PhysX | ||
| Web: | JSP, JSF, Mysql, Tomcat, Netbeans | ||
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